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AMD
XCZU7EV-1FFVF1517E ImageView larger image
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XCZU7EV-1FFVF1517E

Stock Available Reference Price(In US Dollars)
1+
$2,561.23
Manufacturer Part Number:
XCZU7EV-1FFVF1517E
Manufacturer / Brand
AMD
Part of Description:
IC SOC CORTEX-A53 1517FCBGA
Datasheets:
XCZU7EV-1FFVF1517E.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XCZU7EV-1FFVF1517E
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 1517FCBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Supplier Device Package 1517-FCBGA (40x40)
Speed 500MHz, 600MHz, 1.2GHz
Series Zynq® UltraScale+™ MPSoC EV
RAM Size 256KB
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Peripherals DMA, WDT
Package / Case 1517-BBGA, FCBGA
Package Tray
Operating Temperature 0°C ~ 100°C (TJ)
Number of I/O 464
Flash Size -
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Base Product Number XCZU7
Architecture MCU, FPGA

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XCZU7EV-1FFVF1517E Product Details:

Title: XCZU7EV-1FFVF1517E Integrated Circuits (ICs): A Comprehensive Analysis In today's world of technology, integrated circuits (ICs) have become an essential part of electronic devices. The XCZU7EV-1FFVF1517E is a state-of-the-art product that underscores the massive development in SoC technology. Being one of the most highly advanced ICs currently available on the market, the XCZU7EV-1FFVF1517E offers a range of features and performance parameters that make it the perfect choice for many applications. Main Features and Performance Parameters The XCZU7EV-1FFVF1517E boasts an impressive output voltage, current, and power. It has an accuracy that makes it highly efficient, allowing it to function in extreme temperature ranges. This SoC technology has a 1517FCBGA with a Cortex-A53 processor that is exceptional in its class. Application Scenarios and Usage The XCZU7EV-1FFVF1517E is compatible with a variety of electronic devices, making it highly versatile. It is particularly useful in the telecommunications, aerospace, automotive, and medical industries. Additionally, this SoC can be used for specific applications such as embedded computing, image and video processing, and machine learning algorithms. Integrated Circuit Types ICs come in different types, including digital, analog, mixed signal, and RF-based chips. The XCZU7EV-1FFVF1517E is a mixed signal chip that integrates both digital and analog circuits on the same silicon wafer. This SoC technology has numerous benefits, including reduced power consumption, improved performance, and a smaller form factor. Complex Manufacturing Process The manufacturing process of integrated circuits is highly technical and involves several stages such as chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. The XCZU7EV-1FFVF1517E undergoes a rigorous manufacturing process to ensure quality components. Packaging and Testing After the manufacturing process, a product goes through appropriate packaging and testing to ensure component quality. The XCZU7EV-1FFVF1517E is packaged to preserve its precious microchip and protect it from external forces such as vibrations or temperature fluctuations. Conclusion In summary, the XCZU7EV-1FFVF1517E is a cutting-edge IC that offers superior performance, wide-ranging applications, and advanced SoC technology. It is the perfect choice for many industries and applications that need high-quality components to perform optimally. If you're looking for an excellent IC, look no further than the XCZU7EV-1FFVF1517E.

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