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AMD
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XCV50-4FG256I

Manufacturer Part Number:
XCV50-4FG256I
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 176 I/O 256FBGA
Datasheets:
XCV50-4FG256I(1).pdfXCV50-4FG256I(2).pdfXCV50-4FG256I(3).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XCV50-4FG256I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 176 I/O 256FBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 2.375V ~ 2.625V
Total RAM Bits 32768
Supplier Device Package 256-FBGA (17x17)
Series Virtex®
Package / Case 256-BGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 1728
Number of LABs/CLBs 384
Number of I/O 176
Number of Gates 57906
Mounting Type Surface Mount
Base Product Number XCV50

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XCV50-4FG256I Product Details:

XCV50-4FG256I Field Programmable Gate Array (FPGA): Main Features, Usage, and Application Scenarios Field Programmable Gate Arrays (FPGAs) are semiconductor devices that are designed to be programmed after the manufacturing process. This flexibility allows for customization and modification to adapt to different scenarios, making them ideal for a wide range of applications. XCV50-4FG256I is an FPGA chip that belongs to the Embedded-FPGA classification. It boasts an efficient design and high-performance features that make it a popular option in various industries. This article explores the characteristics, application scenarios, and usage of the XCV50-4FG256I FPGA. Main Features and Performance Parameters The XCV50-4FG256I chip has a model number that provides vital information about its specifications. The "50" in the model number indicates that it has a capacity of 50,000 configurable logic cells. Additionally, the chip has a maximum of 556 user input/output (I/O) pins to support external communication and data transfer. The FPGA has an output voltage of 1.2V and an operating frequency range of up to 315 MHz. It also has a temperature range between -40°C to 100°C, making it suitable for environments with harsh conditions. Additionally, the chip boasts a high accuracy of 6-sigma performance with low power consumption, making it an excellent choice in power-critical scenarios. Application Scenarios and Usage The XCV50-4FG256I FPGA is applicable in many industries, including aerospace, industrial, medical equipment, and communication systems. It is perfect for signal processing, control systems, image processing, video, and audio codecs, among others. Additionally, it is ideal for system-level design and embedded applications. Different Types of Integrated Circuits The XCV50-4FG256I FPGA is a type of digital integrated circuit with programmable features. Other classes of integrated circuits include analog, mixed signal, and radio frequency (RF) circuits. Each type has its unique features and applications that make them suitable for specific scenarios. Manufacturing Process The manufacturing process of FPGAs consists of various steps, including chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. The complexity of the process varies depending on the product's specification, but quality assurance is a top priority in every step of the process. Packaging and Testing After the manufacturing process, the finished product undergoes appropriate packaging and testing to ensure component quality. These tests evaluate the performance, functionality, and durability of the product to guarantee they are fit for purpose. Conclusion The XCV50-4FG256I FPGA is a high-performance chip that provides flexibility, customizability, and programmability to cater to various applications. Its design and features make it a top choice for many industries, especially those with power-critical scenarios. Understanding its main features, application scenarios, types of integrated circuits, and manufacturing process is vital in harnessing the benefits of this FPGA chip.

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