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AMD
XC7Z010-L1CLG400I ImageView larger image
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XC7Z010-L1CLG400I

Stock Available Reference Price(In US Dollars)
90+
$82.46
Manufacturer Part Number:
XC7Z010-L1CLG400I
Manufacturer / Brand
AMD
Part of Description:
IC SOC CORTEX-A9 667MHZ 400BGA
Datasheets:
XC7Z010-L1CLG400I.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC7Z010-L1CLG400I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 400BGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Supplier Device Package 400-CSPBGA (17x17)
Speed 667MHz
Series Zynq®-7000
RAM Size 256KB
Primary Attributes Artix™-7 FPGA, 28K Logic Cells
Peripherals DMA
Package / Case 400-LFBGA, CSPBGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of I/O 130
Flash Size -
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Base Product Number XC7Z010
Architecture MCU, FPGA

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC7Z010-L1CLG400I Product Details:

Title: XC7Z010-L1CLG400I Integrated Circuits: Features, Parameters, Application Scenarios, and Manufacturing Process The XC7Z010-L1CLG400I Integrated Circuit is a powerful and versatile System on Chip (SoC) that can be used in various electronic devices and industries. As a highly advanced IC, it offers numerous advanced features and performance parameters, which make it ideal for many applications. Features and Performance Parameters: The XC7Z010-L1CLG400I SoC features a Cortex-A9 processor that can deliver up to 667 MHz of speed. It also has a 400 BGA packaging and provides an ideal hardware platform for many applications. Additionally, it provides excellent accuracy, efficiency, and temperature range, making it suitable for use in different environments. Application Scenarios and Usage: This IC is widely used in various industries and electronic devices such as data center, automotive, aerospace, industrial, medical, and defense. It can also be used for specific applications such as networking, imaging, control, communication, and data storage, among others. With this IC, an excellent performance can be achieved. Types of Integrated Circuits: Integrated circuits come in different types, including digital, analog, mixed signal, and RF. Each type performs a unique function, making it useful in specific applications. Manufacturing Process: The manufacturing of integrated circuits is a complex process that involves various stages such as chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. Each stage is vital to the entire process and plays a role in ensuring the final product's quality. Packaging and Testing: Finished products must undergo appropriate packaging and testing to ensure component quality. This step helps to ensure that the final product meets the manufacturer's specifications and that it functions correctly. Conclusion: The XC7Z010-L1CLG400I Integrated Circuit is a powerful and versatile SoC ideal for use in various industries and electronic devices. It offers advanced features and performance parameters, making it suitable for use in specific applications. With an efficient manufacturing process and appropriate packaging and testing, the component quality is guaranteed, making it an excellent investment for various applications.

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