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AMD
XC6SLX100-N3CSG484C ImageView larger image
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XC6SLX100-N3CSG484C

Stock Available Reference Price(In US Dollars)
84+
$171.37
Manufacturer Part Number:
XC6SLX100-N3CSG484C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 338 I/O 484CSBGA
Datasheets:
XC6SLX100-N3CSG484C.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC6SLX100-N3CSG484C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 338 I/O 484CSBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 1.14V ~ 1.26V
Total RAM Bits 4939776
Supplier Device Package 484-CSPBGA (19x19)
Series Spartan®-6 LX
Package / Case 484-FBGA, CSPBGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 101261
Number of LABs/CLBs 7911
Number of I/O 338
Mounting Type Surface Mount
Base Product Number XC6SLX100

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC6SLX100-N3CSG484C Product Details:

Title: An Overview of XC6SLX100-N3CSG484C Integrated Circuits: Features, Usage, and Manufacturing XC6SLX100-N3CSG484C is a versatile and high-performance embedded FPGA made for advanced electronic devices, industrial automation, and communication systems. This article provides an in-depth introduction to its features, usage, and the complex manufacturing process involved. Features and Performance Parameters: With 338 I/O 484CSBGA capacity, XC6SLX100-N3CSG484C integrated circuits have multiple advantages. The device's output voltage ranges from 1.2V to 3.3V, and the current reaches up to 1A. The accuracy exceeds 1% to ensure that the device can perform with precision. The temperature range of the device is between -40°C to 100°C, giving the product a dynamic range. Application Scenarios and Usage: XC6SLX100-N3CSG484C is widely used for various applications, including medical devices, consumer electronics, industrial automation, and communication systems. The integrated circuits are perfect for tasks that require complex processing and high-speed signal transmission. Different Types of Integrated Circuits: Integrated circuits can be classified into four types, namely digital, analog, mixed signal, and RF. XC6SLX100-N3CSG484C is a digital circuit that uses Field Programmable Gate Arrays (FPGAs), which are known for their capability to program and reprogram circuits. This feature makes them a top choice for flexible system design. Manufacturing Process: The manufacturing of integrated circuits is an intricate process that involves several stages, starting from chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. Every stage is crucial to produce a high-quality integrated circuit with efficient functionality. Packaging and Testing: To ensure component quality, finished products must undergo proper packaging and testing. This final stage is essential to guarantee that the device complies with industry standards and can perform at a high level. Conclusion: In conclusion, XC6SLX100-N3CSG484C integrated circuits offer several benefits, including high performance, a broad temperature range, and versatile usage. Their digital nature makes them a top choice, particularly for applications that require flexible system design. The complex manufacturing process highlights the sophistication and detailed work that goes into producing high-quality integrated circuits. It is important to understand the significance of proper packaging and testing to ensure the product is up to industry standards.

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