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AMD
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XC6SLX100-3FG676C

Stock Available Reference Price(In US Dollars)
40+
$262.03
Manufacturer Part Number:
XC6SLX100-3FG676C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 480 I/O 676FCBGA
Datasheets:
XC6SLX100-3FG676C.pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC6SLX100-3FG676C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 480 I/O 676FCBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 1.14V ~ 1.26V
Total RAM Bits 4939776
Supplier Device Package 676-FBGA (27x27)
Series Spartan®-6 LX
Package / Case 676-BGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 101261
Number of LABs/CLBs 7911
Number of I/O 480
Mounting Type Surface Mount
Base Product Number XC6SLX100

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC6SLX100-3FG676C Product Details:

"XC6SLX100-3FG676C: A Comprehensive View of Embedded-FPGAs for Electronic Devices and Industries" XC6SLX100-3FG676C is a high-end programmable logic device that serves as an ideal solution for a broad range of electronic devices and industries. This FPGA, embedded circuit technology, operates as an advanced component for enhancing electronic devices' performance. Main features: • XC6SLX100-3FG676C model number, FPGA embedded circuit technology • 480 I/O pins • 676FCBGA packaging • Supports applications for multiple electronic devices, industrial equipment and systems. Performance parameters: • Helps to achieve higher accuracy, efficiency, and reliability • Wide temperature range: -40°C to 100°C • Output voltage of 1.2V to 3.3V, current of 1550mA, and power of 3.1W. Application scenarios: XC6SLX100-3FG676C can be used for various applications, including aerospace, Wireless communication, video and image processing, automotive systems and many more. Usage: This programmable logic device is suitable for use in diverse electronic devices, including system on chips, computation, Multi-processors, and high-speed networking. Types of integrated circuits: Integrated circuits come in various types, including digital, analog, mixed signal, and RF. Digital integrated circuits operate using binary logic (0's and 1's) for data processing, while analog integrated circuits operate on continuous signals. Mixed-signal integrated circuits combine both digital and analog circuits, while RF integrated circuits are used mainly for wireless communication devices. Complex manufacturing process: XC6SLX100-3FG676C involves a series of manufacturing processes such as chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching. These processes ensure the FPGA meets the highest industry standards. Quality control: XC6SLX100-3FG676C is tested rigorously to ensure that the finished product meets all the necessary specifications to operate efficiently in the intended application scenario. In conclusion, XC6SLX100-3FG676C is a top-of-the-line embedded-FPGA that offers exceptional performance, accuracy, efficiency, and reliability for numerous electronic devices and industrial applications. With its advanced integrated circuit technology, complex manufacturing process, and extensive testing, it is an ideal solution for enhancing the performance of various electronic devices and equipment.

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