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AMD
XC3S4000-5FGG900C ImageView larger image
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XC3S4000-5FGG900C

Stock Available Reference Price(In US Dollars)
27+
$261.03
Manufacturer Part Number:
XC3S4000-5FGG900C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 633 I/O 900FBGA
Datasheets:
XC3S4000-5FGG900C.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC3S4000-5FGG900C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 633 I/O 900FBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 1.14V ~ 1.26V
Total RAM Bits 1769472
Supplier Device Package 900-FBGA (31x31)
Series Spartan®-3
Package / Case 900-BBGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 62208
Number of LABs/CLBs 6912
Number of I/O 633
Number of Gates 4000000
Mounting Type Surface Mount
Base Product Number XC3S4000

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC3S4000-5FGG900C Product Details:

"XC3S4000-5FGG900C: A Comprehensive Guide on the Ultimate Integrated Circuit Device for Your Electronic Needs" Are you on the lookout for an efficient and reliable integrated circuit device? Look no further than the XC3S4000-5FGG900C. As the top of the line Field Programmable Gate Array (FPGA), the XC3S4000-5FGG900C packs an impressive array of features that guarantee unmatched performance for various electronic applications. The XC3S4000-5FGG900C is a high-end FPGA that comes with 633 Input/Output (I/O) connections pre-installed. This feature makes it an ideal device for complex electronic designs that require high volumes of inputs and outputs. The versatility of the XC3S4000-5FGG900C makes it suitable for use in various industries, including aerospace, automotive, and medical sectors. This device boasts an output voltage range of between 1.2V and 3.3V, with an output current of 1A. Additionally, its power consumption is notably low, with an impressive efficiency rate of up to 95%. The XC3S4000-5FGG900C can handle a temperature range of between -40°C and 100°C. Evidently, the XC3S4000-5FGG900C is a versatile FPGA suited for a wide array of applications. From video processing systems to healthcare devices, this FPGA is the ultimate solution to all your electronic needs. Its mixed-signals, digital, analog, and RF features make it an excellent choice for even the most complex systems. The XC3S4000-5FGG900C's complex manufacturing process is noteworthy. The production process includes chip design, which involves a team of professionals, cleanrooms, and specialized equipment. The chip is exposed to laser processing, back grinding, doping, etching, and vapor deposition processes. The chip's manufacturing process ends when it undergoes rigorous testing, packaging, and sealing to ensure quality and durability. In conclusion, if you seek the ultimate FPGA device, the XC3S4000-5FGG900C is the ideal choice for you. Its advanced features, combined with its versatile nature, make it a perfect fit for complex electronic designs. With this device, you can rest assured that you have the ultimate solution to all your electronic needs.

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