Packaging
We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.
Global Shipment by DHL/FedEx/TNT/UPS
Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
| Shipment charges: |
(Reference DHL and FedEX) |
| Weight(KG): 0.00kg-1.00kg |
Price(USD$) : USD$60.00 |
| Weight(KG): 1.00kg-2.00kg |
Price(USD$) : USD$80.00 |
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.
- Other Shipment Way: SF Express for Asia; Chang-woo special air line for Korea, Aramexfor Middle East countries. Others more shipping way, please contact us.
We also can send the goods to your forwarder or your othersupplier, so that you can send the goods together. It may will save shipmentcharges for you, or may will more convenient for you.
- Shipping Details: Shippinginformation, We need shipping information including Receiver Company Name(Or personal), Receiver Name, Contact Number, Address and Zip Code. Please make sure these information to us, so that we can arrange the shipment faster.
- Delivery time: Deliverytime will need 2-5days to most of country all over the world for DHL/UPS/FEDEX/TNT.
XC17V01SO20C Product Details:
Title: "Explore the Capabilities of XC17V01SO20C: A High-Performance Configuration PROM for FPGA"
In this article, we will be discussing the main features, application scenarios, usage, and manufacturing process of XC17V01SO20C, a configuration PROM for FPGA.
Integrated Circuits Model Number and Main Features:
XC17V01SO20C is an IC PROM SER 1MBIT 3.3V 20-SOIC, designed to provide configuration data to FPGAs. It features a 1 Mbit density, allowing for reliable and flexible configuration for a wide range of FPGA designs.
Product Classification:
XC17V01SO20C is part of the memory category of integrated circuits, specifically designed for configuration PROMs.
Application Scenarios and Usage:
This high-performance configuration PROM is suitable for use in a broad range of electronic devices and industries. It can be used for FPGA-based systems within telecommunications, automotive, industrial automation, and aerospace. In addition, it can support specific applications, such as communications equipment, control systems, and military equipment.
Feature Parameters:
XC17V01SO20C provides an output voltage of 3.3V and a current of 10mA. It has a temperature range of -40°C to 85°C, making it suitable for use in extreme environments. Additionally, it utilizes an advanced laser processing, exposing, and etching to achieve exceptional accuracy and efficiency in data processing.
Types of Integrated Circuits:
XC17V01SO20C is a digital type of integrated circuit since it offers reliable and flexible configuration data for FPGAs.
Complex Manufacturing Process:
XC17V01SO20C undergoes a complex manufacturing process to ensure high quality and performance. This process includes chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, and etching. All these manufacturing processes uphold high quality and standard that goes through rigorous testing to ensure component quality.
Packaging and Testing:
It is essential to note that finished products undergo appropriate packaging and testing to ensure components are of high quality, preventing any damages that may occur during shipping and handling.
In conclusion, XC17V01SO20C is a high-performance configuration PROM ideal for a vast range of industries and electronic devices. Its advanced manufacturing process and quality testing ensure maximum performance, accuracy, and efficiency, making it an excellent choice for FPGA-based systems.