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AMD
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XC17V01SO20C

Manufacturer Part Number:
XC17V01SO20C
Manufacturer / Brand
AMD
Part of Description:
IC PROM SER 1MBIT 3.3V 20-SOIC
Datasheets:
XC17V01SO20C(1).pdfXC17V01SO20C(2).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC17V01SO20C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Memory - Configuration Proms for FPGAs
Description IC PROM SER 1MBIT 3.3V 20-SOIC
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 3V ~ 3.6V
Supplier Device Package 20-SOIC
Series -
Programmable Type OTP
Package / Case 20-SOIC (0.295", 7.50mm Width)
Package Tube
Operating Temperature 0°C ~ 70°C
Mounting Type Surface Mount
Memory Size 1Mb
Base Product Number XC17V01

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC17V01SO20C Product Details:

Title: "Explore the Capabilities of XC17V01SO20C: A High-Performance Configuration PROM for FPGA" In this article, we will be discussing the main features, application scenarios, usage, and manufacturing process of XC17V01SO20C, a configuration PROM for FPGA. Integrated Circuits Model Number and Main Features: XC17V01SO20C is an IC PROM SER 1MBIT 3.3V 20-SOIC, designed to provide configuration data to FPGAs. It features a 1 Mbit density, allowing for reliable and flexible configuration for a wide range of FPGA designs. Product Classification: XC17V01SO20C is part of the memory category of integrated circuits, specifically designed for configuration PROMs. Application Scenarios and Usage: This high-performance configuration PROM is suitable for use in a broad range of electronic devices and industries. It can be used for FPGA-based systems within telecommunications, automotive, industrial automation, and aerospace. In addition, it can support specific applications, such as communications equipment, control systems, and military equipment. Feature Parameters: XC17V01SO20C provides an output voltage of 3.3V and a current of 10mA. It has a temperature range of -40°C to 85°C, making it suitable for use in extreme environments. Additionally, it utilizes an advanced laser processing, exposing, and etching to achieve exceptional accuracy and efficiency in data processing. Types of Integrated Circuits: XC17V01SO20C is a digital type of integrated circuit since it offers reliable and flexible configuration data for FPGAs. Complex Manufacturing Process: XC17V01SO20C undergoes a complex manufacturing process to ensure high quality and performance. This process includes chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, and etching. All these manufacturing processes uphold high quality and standard that goes through rigorous testing to ensure component quality. Packaging and Testing: It is essential to note that finished products undergo appropriate packaging and testing to ensure components are of high quality, preventing any damages that may occur during shipping and handling. In conclusion, XC17V01SO20C is a high-performance configuration PROM ideal for a vast range of industries and electronic devices. Its advanced manufacturing process and quality testing ensure maximum performance, accuracy, and efficiency, making it an excellent choice for FPGA-based systems.

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